A switch assembly for use in an electrical apparatus includes a first contact having a first substrate and a first contact pad. The first contact pad is of copper or of a copper alloy. A second contact has a second substrate and a second contact pad. The second contact pad is of silver or of a silver alloy. The first contact is movably mounting relative to the second contact so that in a make position the first and second contact pads are in electrical contact with one another and in a break position the first and second contact pads are spaced from one another.
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