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Method for phase shift mask design, fabrication, and use

机译:相移掩模设计,制造和使用的方法

摘要

A system and method of strong phase-shifting a beam from an actinic light source in a lithographic process includes focusing a beam from the electromagnetic beam source onto a mask adapted to selectively phase-shift at least a portion of the beam according to a predetermined pattern. The beam is passed from the actinic light source through the mask producing a phase-shifted beam, and the phase-shifted beam is directed at a substrate such as a semiconductor wafer adapted to be selectively etched according to the predetermined pattern. The strong phase-shift serves to substantially eliminate zero-order light in the phase-shifted beam. Strong phase-shift mask techniques, through a two electromagnetic beam interference imaging process, are known in the art of microlithography to form imaging results for features of a size well below the limit of conventional prior art imaging.
机译:一种在光刻过程中对来自光化光源的光束进行强相移的系统和方法,包括将来自电磁束源的光束聚焦到掩模上,该掩模适于根据预定图案选择性地对光束的至少一部分进行相移。 。光束从光化光源通过掩模穿过,从而产生相移光束,并且相移光束对准诸如半导体晶片之类的基板,该基板适于根据预定图案选择性地蚀刻。强相移用于基本上消除相移光束中的零级光。通过两次电磁束干扰成像过程的强相移掩模技术在微光刻技术中是已知的,以形成尺寸远低于常规现有技术成像的极限的特征的成像结果。

著录项

  • 公开/公告号US6800401B2

    专利类型

  • 公开/公告日2004-10-05

    原文格式PDF

  • 申请/专利权人 PETERSEN ADVANCED LITHOGRAPHY INC.;

    申请/专利号US20010843622

  • 发明设计人 JOHN S. PETERSEN;

    申请日2001-04-26

  • 分类号G03F90/00;

  • 国家 US

  • 入库时间 2022-08-21 23:16:55

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