Power distribution design method for stacked flip-chip packages

摘要

A chip-on-chip module and associated method of formation. First and second semiconductor chips are coupled together. The first chip comprises a first wiring layer and a first electrically conductive substrate on first and second sides, respectively, of the first chip. A supply voltage VDD is adapted to be electrically coupled to the second side of the first chip. The second chip comprises a second wiring layer and a second electrically conductive substrate on first and second sides, respectively, of the second chip. A ground voltage GND is adapted to be electrically coupled to the second side of the second chip. The first side of the first chip is electrically coupled to the first side of the second chip. The supply voltage VDD and the ground voltage GND are adapted to provide power to the first and second chips.