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Co-design/simulation of flip-chip assembly for high voltage IGBT packages

机译：用于高压IGBT封装的倒装芯片组件的共同设计/仿真

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P. Rajaguru; C. Bailey; H. Lu; A. M. Aliyu; A. Castellazzi; V. Pathirana; N. Udugampola; T. Trajkovic; F. Udrea; P. D. Mitcheson; A. D. T. Elliott;
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1. Area-I/O Flip-Chip Routing for Chip-Package Co-Design Considering Signal Skews [J] . Fang J.-W., Chang Y.-W. Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on . 2010,第5期

机译：考虑信号偏移的芯片封装协同设计的Area-I / O倒装芯片路由
2. Nonhermetic plastic packaging of high voltage electronic switches utilizing a low-stress glob coating for 95/5Pb/Sn solder joints of flip-chip bonded multichip module high voltage devices [J] . Ching Ping Wong, Segelken J.M. IEEE transactions on components, packaging, and manufacturing technology. Part C, Manufacturing . 1998,第1期

机译：高压电子开关的非密封塑料封装，采用低应力球状涂层，用于倒装芯片键合多芯片模块高压设备的95 / 5Pb / Sn焊点
3. A Fast Board-Power-Voltage Fluctuation Analysis System for Chip-Package-Board Co-Design [J] . Takashi HARADA, Hiroshi WABUKA, Manabu KUSUMOTO, NEC Journal of Advanced Technology . 2005,第3期

机译：用于芯片-封装-电路板协同设计的快速电路板-电源-电压波动分析系统
4. Co-Design/Simulation of Flip-Chip Assembly for High Voltage IGBT Packages [C] . P. Rajaguru, C. Bailey, H. Lu, International Workshop on Thermal Investigations of ICs and Systems . 2017

机译：用于高压IGBT封装的倒装芯片组件的共同设计/仿真
5. Voltage-source inverter options for medium-voltage induction motor drives using high-voltage IGBTs. [D] . Brumsickle, William E. 1998

机译：使用高压IGBT的中压感应电动机驱动器的电压源逆变器选件。
6. Interaction of Diverse Voltage Sensor Homologs with Lipid Bilayers Revealed by Self-Assembly Simulations [O] . Younes Mokrab, Mark S.P. Sansom 2011

机译：自组装模拟显示不同电压传感器同系物与脂质双层的相互作用。
7. Area-I/O Flip-Chip Routing for Chip-Package Co-Design [O] . Jia-wei Fang, Yao-wen Chang 2015

机译：用于芯片封装协同设计的区域I / O倒装芯片布线
8. Reliability assessment of advanced flip-chip interconnect electronic package assemblies under extreme cold temperatures (-190 degrees C and -120 degrees C) [R] . Ramesham, Rajeshuni, Ghaffarian, Reza, Shapiro, Andrew, 2005

机译：极端低温（-190摄氏度和-120摄氏度）下高级倒装芯片互连电子封装组件的可靠性评估

Co-design/simulation of flip-chip assembly for high voltage IGBT packages

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