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Anti-reflective coatings for use at 248 nm and 193 nm

机译:防反射涂层,用于248 nm和193 nm

摘要

The present invention is directed to a silicon carbide anti-reflective coating (ARC) and a silicon oxycarbide ARC. Another embodiment is directed to a silicon oxycarbide ARC that is treated with oxygen plasma. The invention includes method embodiments for forming silicon carbide layers and silicon oxycarbide layers as ARC's on a semiconductor substrate surface. Particularly, the methods include introducing methyl silane materials into a process chamber where they are ignited as plasma and deposited onto the substrate surface as silicon carbide. Another method includes introducing methyl silane precursor materials with an inert carrier gas into the process chamber with oxygen. These materials are ignited into a plasma, and silicon oxycarbide material is deposited onto the substrate. By regulating the oxygen flow rate, the optical properties of the silicon oxycarbide layer can be adjusted. In another embodiment, the silicon oxycarbide layer can be treated with oxygen plasma.
机译:本发明涉及碳化硅抗反射涂层(ARC)和碳氧化硅ARC。另一个实施方案涉及用氧等离子体处理的碳氧化硅ARC。本发明包括用于在半导体衬底表面上形成作为ARC的碳化硅层和碳氧化硅层的方法实施例。特别地,该方法包括将甲基硅烷材料引入到处理室中,在此将它们作为等离子体点燃并以碳化硅的形式沉积在基板表面上。另一方法包括将具有惰性载气的甲基硅烷前体材料与氧气一起引入处理室。将这些材料点燃成等离子体,并将碳氧化硅材料沉积到基板上。通过调节氧气流速,可以调节碳氧化硅层的光学性能。在另一个实施例中,可以用氧等离子体处理碳氧化硅层。

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