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Wiring structure formed in contact hole, manufacturing method therefor, and a display apparatus having the same

机译:在接触孔中形成的布线结构,其制造方法以及具有该结构的显示装置

摘要

A contact hole is formed, by etching that uses buffered hydrofluoric acid, in a gate insulating film made of SiO2 and an interlayer insulating layer, formed on the gate insulating film, which is made of SiN. In this contact hole, there is formed an electrode which includes: a first protective metal layer made of a refractory metal; a wiring layer, formed on the first protective metal layer, which is made of a metal whose resistance is lower than that of the refractory metal; and a second protective metal layer, made of a refractory metal, which is formed thicker than the gate insulating film.
机译:通过使用缓冲氢氟酸的蚀刻,在由SiO 2 制成的栅极绝缘膜和在由SiN制成的栅极绝缘膜上形成的层间绝缘层中形成接触孔。在该接触孔中,形成电极,该电极包括:由难熔金属制成的第一保护金属层;以及由第一保护金属层形成的第一保护金属层。布线层,形成在第一保护金属层上,该布线层由电阻低于耐火金属的金属制成;第二保护金属层由难熔金属制成,其形成得比栅极绝缘膜厚。

著录项

  • 公开/公告号US6717218B2

    专利类型

  • 公开/公告日2004-04-06

    原文格式PDF

  • 申请/专利权人 SANYO ELECTRIC CO. LTD.;

    申请/专利号US20030378907

  • 发明设计人 KOJI SUZUKI;ISAO HASEGAWA;

    申请日2003-03-05

  • 分类号H01L270/10;

  • 国家 US

  • 入库时间 2022-08-21 23:12:50

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