METHOD FOR ATTACHING LEAD PARTS AND SHIELD CASE TO PRINTED CIRCUIT BOARD, AND METHOD FOR ATTACHING CHIP PARTS, LEAD PARTS AND SHIELD CASE TO PRINTED CIRCUIT BOARD

摘要

A METHOD OF ATTACHING A LEAD PART (4) AND A SHIELD CASE (5) FOR PREVENTING A HIGH-FREQUENCY SIGNAL FROM BEING LEAKED TO A PRINTED CIRCUIT BOARD (1) INCLUDES A SOLDER COATING STEP OF COATING SOLDER (3,6) SO THAT THE SOLDER SHOULD (3,6) COVER THE WHOLE OF AN APERTURE (LH) PROVIDED THROUGH A PRINTED CIRCUIT BOARD (1) INTO WHICH A LEAD (4L) OF THE LEAD PART (4) IS INSERTED AND SO THAT THE SOLDER (3,6) SHOULD COVER A PART OF AN APERTURE (1S) PROVIDED THROUGH THE PRINTED CIRCUIT BOARD (1) INTO WHICH AN ENGAGEMENT PORTION OF THE SHIELD CASE (5) IS INSERTED, A MOUNTING STEP OF INSERTING THE LEAD (4L) OF THE LEAD PART (4) AND THE ENGAGEMENT PORTION OF THE SHIELD CASE (5) INTO THE RESPECTIVE APERTURES (LH,LS) TO THEREBY MOUNT THE LEAD PART (4) AND THE SHIELD CASE (5) ON THE PRINTED CIRCUIT BOARD (1), AND A SOLDERING STEP OF INSERTING THE PRINTED CIRCUIT BOARD (1) MOUNTED WITH THE LEAD PART (4) AND THE SHIELD CASE (5) INTO A REFLOWING FURNACE AND MELTING THE SOLDER (3,6) TO THEREBY CARRY OUT SOLDERING. (FIG.2D,2G,2H)