首页> 外国专利> A method of attaching a lead component and a shield case to a printed circuit board, and a method of attaching a chip component, a lead component and a shield case to a printed circuit board (Method for Attaching the Leaded Parts and the Shield Case to a Printed Board) Parts, the Lead Parts and the Shield Case on the Printed Plate Board)

A method of attaching a lead component and a shield case to a printed circuit board, and a method of attaching a chip component, a lead component and a shield case to a printed circuit board (Method for Attaching the Leaded Parts and the Shield Case to a Printed Board) Parts, the Lead Parts and the Shield Case on the Printed Plate Board)

机译:将引线组件和屏蔽壳附接到印刷电路板上的方法,以及将芯片组件,引线组件和屏蔽壳附接到印刷电路板上的方法(将引线部分和屏蔽壳附接到引线板上的方法印制板)零件,引线零件和印制板上的屏蔽盒)

摘要

A method of attaching a lead component and a shield case to a printed circuit board that can reduce process and airflow and improve solder application accuracy for soldering between a printed circuit board and a shield case as compared with a conventional method, , A method of attaching a lead part and a shield case to a printed circuit board.;A plurality of leads 4L of the printed circuit board 1 and a plurality of leads 4L and parts 4 on a part of the wiring pattern in the vicinity of each hole into which each lead 4L of the component 4 is to be inserted, Solder 3 or 6 is formed on the land L made of the conductive layer in the vicinity of the slit into which each part having each piece 5N of the plurality of shield cases 5 corresponding to each of the shield cases 5, A plurality of leads 4L and four leads 4L of the component 4 are passed through the respective holes of the printed board 1 and a plurality of leads 4L and 4 are surrounded Each part of each of the plurality of shield cases 5 having the piece 5N is passed through the slit of the printed circuit board 1 and the respective pieces 5N are bent to the land side so that the lead 4L, (4) and the shield case (5) on the printed board (1); and a step of mounting the printed board (1) on which the plurality of leads (4L) Furouro And the leads 4L of the component 4 and the individual pieces 5N of the plurality of shield cases 5 are melted by the predetermined wiring of the printed board 1 And a step of dividing and dividing the printed board 1 into a plurality of sets of the leads 4L, the components 4 and the shield cases 5 to obtain a plurality of individual circuit blocks .
机译:与传统方法相比,将引线组件和屏蔽壳附接到印刷电路板上的方法,该方法可以减少工艺和气流,并提高在印刷电路板和屏蔽壳之间进行焊接的焊料施加精度,印刷电路板1的多条引线4L和布线图案的一部分上的多个引线4L和部分4在每个孔附近的每个孔的附近。将要插入元件4的引线4L,在由狭缝附近的由导电层制成的焊盘L上形成焊料3或6,在该狭缝附近,每个部分具有多个屏蔽壳5的每个片5N,每个屏蔽壳5N在屏蔽盒5中,部件4的多根引线4L和4根引线4L穿过印刷板1的各个孔,并且多根引线4L和4被包围。具有片5N的金属基板5穿过印刷电路板1的狭缝,并且各个片5N弯曲到焊盘侧,使得印刷板(1)上的引线4L,(4)和屏蔽壳(5) );以及安装印刷电路板(1)的步骤,在该印刷电路板上,多条引线(4L)和Furouro以及部件4的引线4L和多个屏蔽壳5的单片5N通过预定的印刷布线而熔化。以及将印刷电路板1划分为多组引线4L,部件4和屏蔽壳5的步骤,以获得多个单独的电路块。

著录项

  • 公开/公告号KR19980018738A

    专利类型

  • 公开/公告日1998-06-05

    原文格式PDF

  • 申请/专利权人 이데이 노브유끼;

    申请/专利号KR19970039220

  • 发明设计人 쓰루사끼 아라따;

    申请日1997-08-18

  • 分类号H05K3/12;

  • 国家 KR

  • 入库时间 2022-08-22 02:48:35

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