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A method of attaching a lead component and a shield case to a printed circuit board, and a method of attaching a chip component, a lead component and a shield case to a printed circuit board (Method for Attaching the Leaded Parts and the Shield Case to a Printed Board) Parts, the Lead Parts and the Shield Case on the Printed Plate Board)
A method of attaching a lead component and a shield case to a printed circuit board, and a method of attaching a chip component, a lead component and a shield case to a printed circuit board (Method for Attaching the Leaded Parts and the Shield Case to a Printed Board) Parts, the Lead Parts and the Shield Case on the Printed Plate Board)
A method of attaching a lead component and a shield case to a printed circuit board that can reduce process and airflow and improve solder application accuracy for soldering between a printed circuit board and a shield case as compared with a conventional method, , A method of attaching a lead part and a shield case to a printed circuit board.;A plurality of leads 4L of the printed circuit board 1 and a plurality of leads 4L and parts 4 on a part of the wiring pattern in the vicinity of each hole into which each lead 4L of the component 4 is to be inserted, Solder 3 or 6 is formed on the land L made of the conductive layer in the vicinity of the slit into which each part having each piece 5N of the plurality of shield cases 5 corresponding to each of the shield cases 5, A plurality of leads 4L and four leads 4L of the component 4 are passed through the respective holes of the printed board 1 and a plurality of leads 4L and 4 are surrounded Each part of each of the plurality of shield cases 5 having the piece 5N is passed through the slit of the printed circuit board 1 and the respective pieces 5N are bent to the land side so that the lead 4L, (4) and the shield case (5) on the printed board (1); and a step of mounting the printed board (1) on which the plurality of leads (4L) Furouro And the leads 4L of the component 4 and the individual pieces 5N of the plurality of shield cases 5 are melted by the predetermined wiring of the printed board 1 And a step of dividing and dividing the printed board 1 into a plurality of sets of the leads 4L, the components 4 and the shield cases 5 to obtain a plurality of individual circuit blocks .
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