MATERIAL FOR ELECTRONIC COMPONENTS, METHOD OF CONNECTING MATERIAL FOR ELECTRONIC COMPONENTS, BALL GRID ARRAY TYPE ELECTRONIC COMPONENTS AND METHOD OF CONNECTING BALL GRID ARRAY TYPE ELECTRONIC COMPONENTS

摘要

A material for an electronic component having a plating layer Aformed of metals X and Y mixed with each other on a base metal materialand a coating layer B formed of the metal X provided on the plating layer Ais provided, whereby wettability of soldering is satisfactory ensured,degradation of solderability and appearance is prevented and generation ofwhiskers can also be prevented.