Wafer-scale replication-technique for opto-mechanical structures on opto-electronic devices

摘要

In a partial UV-casting process carried out on a wafer scale the process of separating the wafer and the mold may significantly be improved by providing elevated temperatures and/or a reduced viscosity of the replication material during and/or immediately before the separation. Thus, even delicate replica features may be obtained. In a preferred embodiment, an organically modified ceramic material is used as the replication material.