Printed circuit board with buried resistor preparing and optimizing method for the same

摘要

PURPOSE: A printed circuit board, a method for manufacturing the same and a method for optimizing the same are provided to achieve improved accuracy of the resistant value by optimizing the resistant value of the buried resistor of the printed circuit board. CONSTITUTION: A method for manufacturing a printed circuit board comprises a step of forming a pair of patterned resistor metal pads which are spaced apart from each other on a resin-based insulating substrate; a step of electrically connecting the resistors to the resistor pads by forming a thick film resistor between the resistor metal pads; a step of measuring the resistant value of the resistor, and determining the volume of spot processing of laser from the variance between the measured resistant value and the target resistant value; a step of performing a laser spot processing on the resistor in such a manner that the resistor has a target resistant value; and a step of forming a solder resistor or a cover coating layer on the substrate in such a manner that the spot processed resistor and the resistor pad are covered.