SEMICONDUCTOR DEVICE TO AVOID DETERIORATION OF ELECTRICAL CHARACTERISTIC AND PHYSICAL BREAKDOWN OF FUNCTIONAL DEVICE LIKE MEMORY DEVICE, LOGIC DEVICE, ETC. FORMED IN PLURAL SEMICONDUCTOR CHIPS STACKED ON STACK BASE

摘要

PURPOSE: A semiconductor device is provided to avoid deterioration of an electrical characteristic and physical breakdown of a functional device(e.g. a circuit device or a semiconductor device) like a memory device, a logic device, etc. formed in a plurality of semiconductor chips stacked on a stack base, and to form a fine interconnection pitch of an interconnection for relaying wires for wire bonding without deteriorating the bonding intensity of the wire. CONSTITUTION: At least one semiconductor chip(2) having an externally drawn-out electrode is stacked on a stack base(4). An interposer chip(3) having at least one interconnection is formed. The externally drawn-out electrode formed in the at least one semiconductor chip is connected to the interconnection in the at least one interposer chip by a wire bonding process. The externally drawn-out electrode formed in the semiconductor chip connected to the interconnection is electrically connected to an electrode of an interconnection formed in the stack base or another semiconductor chip.