SEMICONDUCTOR DEVICE TO IMPROVE COHERENCE BETWEEN BONDING PAD AND SECOND INTERCONNECTION LAYER OR INSULATION LAYER AND PREVENT CRACK FROM BEING GENERATED IN INSULATION LAYER BETWEEN BONDING PAD AND SECOND INTERCONNECTION

摘要

PURPOSE: A semiconductor device is provided to improve coherence between a bonding pad and the second interconnection layer or an insulation layer and prevent a crack from being generated in an insulation layer between the bonding pad and the second interconnection layer even if stress is applied to the bonding pad by forming the bonding pad on the active region of a semiconductor substrate. CONSTITUTION: A semiconductor device is formed on a semiconductor substrate. The first interconnection layer is formed over an operation region of the semiconductor substrate in which the semiconductor device is formed, electrically connected to the operation region. The second interconnection layer(2) is formed over the first interconnection layer on the semiconductor substrate. For an electrical connection with an outer connection terminal, a bonding pad(1) is formed on the second interconnection layer on the substrate while at least a part of the bonding pad is positioned right over the operation region. The second interconnection layer has a plurality of interconnections in a region right under the bonding region. One of the plurality of interconnections is connected to the bonding pad, and an insulation layer(5) is formed between the other of the plurality of interconnections and the bonding pad.