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Semiconductor module, e.g. for power semiconductor applications, has insulator that is resistant to high temperatures, arranged between package wall and semiconductor device
Semiconductor module, e.g. for power semiconductor applications, has insulator that is resistant to high temperatures, arranged between package wall and semiconductor device
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机译:半导体模块对于功率半导体应用,在封装壁和半导体器件之间布置了具有耐高温的绝缘体
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摘要
A semiconductor device (1) is arranged between two connection electrodes (3a). The semiconductor device is enclosed in an insulating package (5,11,12). Within the package, a high temperature-resistant insulator (4) is arranged between a wall of the package and the semiconductor device.
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