A method for contamination tolerant adhesive bonding of assembly parts

摘要

The introduction of vibration energy into not yet hardened adhesive matrix during / or after the joining of workpieces effects an efficient solution and / or dispersion of adhesion-reducing contamination of the substrate surface, which extends into the adhesive matrix. This can, in many cases, the expenditure for extensive purification process or be reduced quality assurance measures. In particular, the final pretreatment and cleaning of the parts to be joined in the adhesive for this purpose, is ruled out that an adhesion-reducing recontamination.