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Manufacture of printed circuit board with embedded capacitors by forming ground layer copper foil on inner layer of printed circuit board, and coating polymer capacitor paste having high-dielectric constant on ground layer copper foil
Manufacture of printed circuit board with embedded capacitors by forming ground layer copper foil on inner layer of printed circuit board, and coating polymer capacitor paste having high-dielectric constant on ground layer copper foil
A printed circuit board with embedded capacitors is manufactured by: forming a ground layer copper foil on an inner layer of the printed circuit board; coating a polymer capacitor paste (105a, 105b) having high-dielectric constant on the ground layer copper foil (104a, 104b); layering a power layer copper foil (106a, 106b); forming a dry film pattern and etching; layering an insulation layer-attached copper film; and forming and plating a blind via-hole and a through-hole. Manufacture of a printed circuit board with embedded capacitors comprises: forming a ground layer copper foil on an inner layer of a printed circuit board, followed by roughening a surface of the ground layer copper foil; coating a polymer capacitor paste having high-dielectric constant at a predetermined thickness on the ground layer copper foil, and curing the coated polymer capacitor paste; layering a power layer copper foil to the cured capacitor; forming a dry film pattern on the power layer copper foil, and etching the dry film pattern by use of an etching mask so that the power layer copper foil is partitioned; layering an insulation layer-attached copper film to the power layer copper foil; forming a blind via-hole and a through-hole at predetermined portions of the insulation layer-attached copper film; and plating the blind via-hole and the through-hole for layer connection.
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