首页> 外国专利> printed circuit board and method for the manufacture of such a printed circuit board (pcb) and a schichtverbundmaterials for such a printed circuit board (pcb)

printed circuit board and method for the manufacture of such a printed circuit board (pcb) and a schichtverbundmaterials for such a printed circuit board (pcb)

机译:印刷电路板以及用于制造这种印刷电路板(pcb)的方法以及用于这种印刷电路板(pcb)的鹅卵石材料

摘要

A printed circuit board for an electronic circuit, especially for the ultra-high frequencies located in the GHz range that comprises at least one conductor layer, which is arranged on top of an insulating layer and which is flatly joined to said insulating layer. Improved mechanical, thermal and electrical properties are attained by virtue of the fact that the insulating layer is a thin glass layer.
机译:一种用于电子电路的印刷电路板,特别是用于位于GHz范围内的超高频的印刷电路板,其包括至少一个导体层,该导体层布置在绝缘层的顶部并且平坦地接合到所述绝缘层。由于绝缘层是薄玻璃层的事实而获得改善的机械,热和电性能。

著录项

  • 公开/公告号DE50103348D1

    专利类型

  • 公开/公告日2004-09-23

    原文格式PDF

  • 申请/专利权人 PPC ELECTRONIC AG CHAM;

    申请/专利号DE20015003348T

  • 发明设计人 STRAUB PETER;WEBER PETER;

    申请日2001-08-02

  • 分类号H05K1/03;

  • 国家 DE

  • 入库时间 2022-08-21 22:42:06

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