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METHOD FOR REMOVING SULFATE ION, METHOD FOR REGENERATING COPPER/COBALT PLATING SOLUTION, APPARATUS FOR REMOVING SULFATE ION AND APPARATUS FOR REGENERATING COPPER/COBALT PLATING SOLUTION
METHOD FOR REMOVING SULFATE ION, METHOD FOR REGENERATING COPPER/COBALT PLATING SOLUTION, APPARATUS FOR REMOVING SULFATE ION AND APPARATUS FOR REGENERATING COPPER/COBALT PLATING SOLUTION
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机译:去除硫酸根离子的方法,再生铜/钴镀液的方法,去除硫酸根离子的装置和再生铜/钴镀液的设备
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摘要
PROBLEM TO BE SOLVED: To provide a method for removing sulfate ions where sulfate ions contained in a used copper/cobalt plating solution are effectively removed, and the updating frequency of the copper/cobalt plating solution can be reduced, to provide an apparatus for removing sulfate ions, to provide a method for regenerating a copper/cobalt plating solution, and to provide an apparatus for regenerating a copper/cobalt plating solution.;SOLUTION: A weakly basic anion exchange resin is added to a used copper/cobalt plating solution comprising sulfate ions, and the sulfate ions in the copper/cobalt plating solution and the weakly basic anion exchange resin are reacted in a reaction tank 31, thus the excessive sulfate ions are removed from the used copper/cobalt plating solution. Then, copper sulfate and/or cobalt sulfate and ammonia and/or boric acid are replenished by insufficient quantities, thus the copper/cobalt plating solution is regenerated.;COPYRIGHT: (C)2005,JPO&NCIPI
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