Control of Accumulation of Cu(I) in Copper Sulfate Electroplating Plating Solution

摘要

Formation and accumulation of Cu(I) in copper sulfate electroplating solutions were discussed. By electrolysis, the accumulation of Cu(I) in the plating solutions was also confirmed in the laboratory. Accumulation rate and amount will depends on the current density and electrolysis time and the dissolved gases. Cu(I) is held in an aqueous solution as a complex with PEG, and gradually it is consumed by oxidation or disproportionation reaction. In the plating solutions using a nano bubble water, formation and accumulation rate of Cu(I) was different by gas species dissolved. Our results indicate the possibility for control of Cu(I) in the plating solutions.