COPPER SULFATE COPPER SULFATE SOLUTION PLATING SOLUTION METHOD OF MANUFACTURING COPPER SULFATE METHOD OF MANUFACTURING SEMICONDUCTOR CIRCUIT BOARD AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

摘要

[PROBLEMS] To provide a copper sulfate, a copper sulfate solution, a plating solution, a method for producing copper sulfate, a method for producing a semiconductor circuit board, and a method for producing an electronic device having a reduced aluminum concentration. [Solution] Copper sulfate having an Al concentration of 0.08 mass ppm or less.