COPPER SULFATE COPPER SULFATE SOLUTION PLATING SOLUTION METHOD OF MANUFACTURING COPPER SULFATE METHOD OF MANUFACTURING SEMICONDUCTOR CIRCUIT BOARD AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

摘要

The present invention provides a copper sulfate, a copper sulfate solution, a plating solution, a manufacturing method of a copper sulfate, a manufacturing method of a semiconductor circuit board and a manufacturing method of an electronic device, which reduce an aluminum (Al) concentration. The copper sulfate has the Al concentration of 0.08 mass ppm or less.