DRY ETCHING METHOD, MICROLENS ARRAY AND FORMING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a method for etching with suppressing an occurrence of a subtrench and to provide a microlens array and a forming method thereof.;SOLUTION: The dry etching method consists of the first process of etching by applying a bias electric voltage to a substrate and the second process of etching after altering the bias voltage lower than that of the first process, each conducted under a plasma atmosphere, the first process using an etching gas of a fluorocarbon gas containing as an added gas a Cx₁Fy₁ (x₁= 2-5; y₁=4-12; and x₁/y₁≥0.4) and the second process using an etching gas of a fluorocarbon gas containing as an added gas a Cx₂Fy₂ (x₂=1-3; y₂=4-8; and x₂/y₂0.4) and furthermore the bias voltage and the etching gas being altered under the continuous state of plasma electric discharge at a time of changing from the first process after smoothing the surface of the substrate to the second process. The microlens array is obtained by this etching method.;COPYRIGHT: (C)2006,JPO&NCIPI