CONDUCTIVE PASTE FOR FILLING VIA HOLE, AND CERAMIC MULTILAYER CIRCUIT BOARD USING IT

摘要

PROBLEM TO BE SOLVED: To provide conductive paste for filling a via hole having a low electric resistance value without generating a void nor a protrusion between a ceramic and a via hole filling conductor even when baked with a ceramic green sheet at the same time; to provide a ceramic multilayer circuit board using the conductive paste.;SOLUTION: This conductive paste is used for filling a via hole of the ceramic multilayer circuit board, and contains: Ag powder; 0.1-3.0 wt.% of Mn powder; and 0.1-3.0 wt.% of Pd powder or Pt powder.;COPYRIGHT: (C)2005,JPO&NCIPI