首页> 外国专利> LOW TEMPERATURE BURNED PORCELAIN COMPOSITION, LOW TEMPERATURE BURNED PORCELAIN AND WIRING BOARD

LOW TEMPERATURE BURNED PORCELAIN COMPOSITION, LOW TEMPERATURE BURNED PORCELAIN AND WIRING BOARD

机译:低温烧制陶瓷组成,低温烧制陶瓷和接线板

摘要

PROBLEM TO BE SOLVED: To provide a low temperature burned porcelain whose dielectric constant is low and especially whose mechanical strength is large, and a wiring board using the same.;SOLUTION: The low temperature burned porcelain consists of 15-70 vol% glassy component which contains 30-45 mol% SiO2, 1-20 mol% B2O3, 1-20 mol% Al2O3, 30-45 mol% MgO and 99 mol% or more of the total of them and a filler component which contains 15-55 vol% of the total of alumina and cordierite.;COPYRIGHT: (C)2005,JPO&NCIPI
机译:解决的问题:提供一种介电常数低,特别是机械强度高的低温烧成瓷器,以及使用该瓷器的配线板。解决方案:低温烧成瓷由15-70%(体积)的玻璃成分组成其中包含30-45 mol%SiO 2 ,1-20 mol%B 2 O 3 和1-20 mol%Al 2 O 3 ,30-45 mol%的MgO和99 mol%或更高的填充剂成分和占氧化铝和堇青石总量的15-55体积%的填料成分。;版权:(C)2005,JPO&NCIPI

著录项

  • 公开/公告号JP2004323275A

    专利类型

  • 公开/公告日2004-11-18

    原文格式PDF

  • 申请/专利权人 KYOCERA CORP;

    申请/专利号JP20030118433

  • 发明设计人 TERASHI YOSHITAKE;HORIUCHI NOBUOKI;

    申请日2003-04-23

  • 分类号C04B35/16;C04B35/195;H01L23/15;H05K3/46;

  • 国家 JP

  • 入库时间 2022-08-21 22:35:00

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号