COMPOSITE MATERIAL COMPOSITION WITH HIGH DIELECTRIC CONSTANT AND LOW DIELECTRIC DISSIPATION FACTOR, CURABLE FILM, CURED PRODUCT AND METHOD FOR PRODUCING THE CURED PRODUCT

摘要

PROBLEM TO BE SOLVED: To provide a composite material composition of high dielectric constant and low dielectric dissipation factor, good in processability having a dielectric constant of ≥15 and a dielectric dissipation factor of ≤0.05 in the frequency range from 100 MHz to 80 GHz, to provide a curable film, to provide a cured product, and to provide a method for producing the cured product.;SOLUTION: The composite material composition of high dielectric constant and low dielectric dissipation factor comprises a crosslinkable component having a plurality of styrene groups with a weight-average molecular weight of ≤1,000 represented by the general formula[1][ wherein, R is a (substituted) hydrocarbon skeleton; R¹ is H, methyl or ethyl; m is an integer of 1-4; and n is an integer of ≥2 ] and an a resin containing at least one polymer with a weight-average molecular weight of ≥5,000, wherein the resin is dispersed with inorganic fillers essentially comprising metallic powder with the mean particle size for the respective filler components being ≤5μm.;COPYRIGHT: (C)2005,JPO&NCIPI