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Importance of High Energy Photons in the Curing of Spin-On Low Dielectric Constant Interconnect Materials

机译：高能光子在旋涂低介电常数互连材料固化中的重要性

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R. Sharangpani; K. C. Cherukuri; R. Singh;
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1. Thermal furnace and Ultraviolet assisted curing impact on SiOCH spin-on ultra low dielectric constant materials [J] . A. Zenasni, B. Remiat, C. Waldfried, Thin Solid Films . 2008,第6期

机译：热炉和紫外线辅助固化对SiOCH旋涂超低介电常数材料的影响
2. A novel sub-half micron Al-Cu via plug interconnect using low dielectric constant material as inter-level dielectric [J] . Zhao B., Biberger M.A. IEEE Electron Device Letters . 1997,第2期

机译：使用低介电常数材料作为层间电介质的新型亚半微米Al-Cu过孔塞互连
3. Theoretical derivation of dielectric constant for low-k materials aiming to k<1.5 interconnects process [J] . Takuya Fukuda, Nobuo Aoi, Azuma Matsuura, 電子情報通信学会技術研究報告. シリコン材料·デバイス. Silicon Devices and Materials . 2000,第603期

机译：针对k <1.5互连工艺的低k材料介电常数的理论推导
4. Properties development during curing of low dielectric-constant spin-on glasses [C] . Robert F.Cook, Eric G.Liniger, David P.Klaus, Symposium on low-dielectric constant materials . 1998

机译：低介电常数旋涂玻璃固化过程中的性能发展
5. Anisotropy of low dielectric constant materials and reliability of copper/low-k interconnects. [D] . Cho, Taiheui. 2000

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Importance of High Energy Photons in the Curing of Spin-On Low Dielectric Constant Interconnect Materials

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