Photosensitive resin composition having low dielectric characteristic, method for producing pattern cured product using the same, and cured material of photosensitive resin composition having low dielectric characteristic

摘要

Problem to be solved: to provide a photosensitive resin composition having a low dielectric characteristic having a good low dielectric characteristic, a photolithography property and an insulating reliability, a method of manufacturing a pattern hardened material using the same, and a cured product using a photosensitive resin composition having a low dielectric characteristic as an interlayer insulating film, a cover coat layer or a surface protective film.Solution: a resin composition used to form an insulating layer, wherein the resin composition comprises a resin containing an aromatic polyester imide structure, a photopolymerization initiator and a thermal radical polymerization initiator, wherein the resin containing the aromatic polyester imide structure does not contain double bonds The present invention further comprises a photosensitive resin composition having a low dielectric characteristic containing a (meta) acryloyl compound.Diagram