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SUBSTRATE FOR OPTOELECTRONIC DEVICE, MANUFACTURING METHOD OF SUBSTRATE FOR OPTOELECTRONIC DEVICE, OPTOELECTRONIC DEVICE, MANUFACTURING METHOD OF OPTOELECTRONIC DEVICE, AND ELECTRONIC EQUIPMENT
SUBSTRATE FOR OPTOELECTRONIC DEVICE, MANUFACTURING METHOD OF SUBSTRATE FOR OPTOELECTRONIC DEVICE, OPTOELECTRONIC DEVICE, MANUFACTURING METHOD OF OPTOELECTRONIC DEVICE, AND ELECTRONIC EQUIPMENT
PROBLEM TO BE SOLVED: To provide a pair of substrates for an optoelectronic device with excellent electric insulation property which are placed close and opposite to each other, in which concentration of pressure on the elements of the substrate rarely occurs even when excessive pressure is applied between the substrates, and to provide the optoelectronic device or the like utilizing the substrates.;SOLUTION: The pair of substrates for the optoelectronic device are oppositely used and comprise a first and a second substrate for the optoelectronic device. The first substrate for the optoelectronic device is provided with a first glass substrate as the substrate, a coloring layer, a black matrix as a light shielding layer, a surface protection layer and electric wiring provided thereon. The second substrate for the optoelectronic device is provided with a second glass substrate as an opposite substrate, an element first electrode constituting a plurality of elements, an insulation film, an element second electrode, and a plurality of pixel electrodes. Also, surface protection layer non-formation portions are provided on the first substrate for the optoelectronic device at the position corresponding to the elements of the second substrate for the optoelectronic device.;COPYRIGHT: (C)2005,JPO&NCIPI
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