首页>
外国专利>
The photosensitive polymer and the chemical amplification die resist constituent and the production mannered null expression I which
The photosensitive polymer and the chemical amplification die resist constituent and the production mannered null expression I which
展开▼
机译：光敏聚合物和化学放大芯片的抗蚀剂成分及生产方式无效表达式I
展开▼
页面导航
摘要
著录项
相似文献
摘要
PROBLEM TO BE SOLVED: To provide a photosensitive polymer, a resist composition containing the polymer and a method for producing the polymer.;SOLUTION: The photosensitive polymer is represented by formula I (where R1 is an acid decomposable tertiary alkyl; R2 is γ-butyrolacton-1, γ- butyrolacton-3-yl, mevalonic lactone, 3-tetrahydrofuranyl, 2, 3-propylene carbonate-1-yl or 3-methyl-γ-butyrolacton-3-yl; R3 is H, methyl, ethyl or a 3-20C alicyclic hydrocarbon compound; p/(p+q+r)=0.1 to 0.8; q/(p+q+r)=0.2 to 0.8; and r/(p+q+r)=0.0 to 0.4).;COPYRIGHT: (C)2001,JPO
展开▼
机译：解决的问题：为了提供光敏聚合物，包含该聚合物的抗蚀剂组合物和制备该聚合物的方法。解决方案：该光敏聚合物由式I表示（其中R 1是酸可分解的叔烷基; R 2是γ;和-丁内酯-1，γ-丁内酯-3-基，甲戊内酯，3-四氢呋喃基，2，3-碳酸亚丙酯-1-基或3-甲基-γ-丁内酯-3-基; R 3是H，甲基，乙基或3-20C脂环族烃化合物; p /（p + q + r）= 0.1至0.8; q /（p + q + r）= 0.2至0.8;和r /（p + q + r）= 0.0至0.4）。;版权：（C）2001，日本特许厅
展开▼
