Production manner of the pin stand facilities resin make substrate and the pin stand facilities resin make substrate, it is not, from the composite material which includes

摘要

PROBLEM TO BE SOLVED: To provide a pin-protruded resin substrate which is difficult to break when a stress is applied to the pin and has high reliability, a manufacturing method of thin pin-protruded resin substrate, a pin to be used for pin-protruded substrate, and its manufacturing method. SOLUTION: A pin-protruded resin substrate 11 is provided with a resin substrate 13 made of resin or the like and having a pin pad 17AP exposed to a main face 13A, and a large number of pins 1 jointed to the pin pad AP with solder HD. The pin 1 is formed using a wire MT made of 194 alloy to which heat treatment is given after pre-heated to 450 to 900 degrees centigrade. Also, the pin 1 has a rod-state part 1A and a large-diameter part 1B including a spherical face inflated in the direction opposite to this rod-state part 1A. The large-diameter parts 1B and so on are soldered to the pin pad 17AP.