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METHOD OF DETERMINING THE ACTIVE REGION WIDTH BETWEEN SHALLOW TRENCH ISOLATION STRUCTURES USING A C-V MEASUREMENT TECHNIQUE FOR FABRICATING A FLASH MEMORY SEMICONDUCTOR DEVICE AND A DEVICE THEREBY FORMED
METHOD OF DETERMINING THE ACTIVE REGION WIDTH BETWEEN SHALLOW TRENCH ISOLATION STRUCTURES USING A C-V MEASUREMENT TECHNIQUE FOR FABRICATING A FLASH MEMORY SEMICONDUCTOR DEVICE AND A DEVICE THEREBY FORMED
A method of determining the active region width (10) of an active region (4) by measuring the respective capacitance values (C100, C100′, C100″) of respective composite capacitance structures (100, 100′, 100″), respectively comprising at least one capacitor element(16, 17, 18; 16′, 17′, 18″; 16″, 17″, 18″) having respective predetermined widths (Wi) for fabricating a flash memory semiconductor device, and a device thereby fabricated. The present method also comprises plotting the respective capacitance values (C100, C100′, C100″) as a quasi-linear function (CW) of the respective predetermined widths (Wi), extrapolating a calibration term (WC=0) from the quasi-linear function (CW), and subtracting the calibration term (WC=0) from the respective predetermined widths (Wi) to define and constrain the active region width (10) for facilitating device fabrication.
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