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Method of transferring ultrathin substrates and application of the method to the manufacture of a multi-layer thin film device
Method of transferring ultrathin substrates and application of the method to the manufacture of a multi-layer thin film device
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机译:转移超薄基板的方法及其在制造多层薄膜器件中的应用
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摘要
The present invention provides a method of transfer of a first planar substrate with two major surfaces to a second substrate, comprising the steps of: forming the first planar substrate, attaching one of the major surfaces of the first planar substrate to a carrier by means of a release layer; attaching the other major surface of the first substrate to the second substrate with a curable polymer adhesive layer; partly curing the polymer adhesive layer, disconnecting the release layer from the first substrate to separate the first substrate from the carrier, followed by curing the polymer adhesive layer.;The method may be used to form a stack of dies (4, 14...) which are adhered together by cured polymeric layers (7, 17). Each die (4, 14...) may include a device layer and an ultra-thin substrate manufactured and assembled by the method described above.
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