METHOD FOR FABRICATING TAPE CARRIER FOR TAB TO AVOID UNDULATION ON DIVIDED CROSS SECTION AND PREVENT CIRCUIT PATTERN FROM BEING TORN EVEN IF CIRCUIT PATTERN IS THIN

摘要

PURPOSE: A method for fabricating a tape carrier for TAB(tape automated bonding) is provided to avoid undulation on a divided cross section and prevent a circuit pattern from being torn even if the circuit pattern is thin by forming a slit hole on a metal support layer and by dividing an insulation layer along the slit hole and separating the insulation layer into each column. CONSTITUTION: An insulation layer is directly formed on a metal support layer. A plurality of interconnection pattern columns(L) are directly formed on the insulation layer. A slit hole(S) is formed between adjacent interconnection pattern columns in the metal support layer. The insulation layer is divided along the slit hole to separate the plurality of interconnection pattern columns into each interconnection pattern column.