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Epi Structure and Fabrication Method of InP based MOSFET for Uniform Device Characteristics

机译:具有均匀器件特性的基于InP的MOSFET的Epi结构和制造方法

摘要

PURPOSE: An epitaxial structure for InP based MOSFET(Metal Oxide Semiconductor Field Effect Transistor) and a method for manufacturing an MOSFET using the same are provided to be capable of obtaining stable and uniform device characteristics by carrying out a liquid phase oxidation step and an oxygen plasma processing step. CONSTITUTION: An epitaxial structure is provided with a semi-insulating InP substrate(10), an InAlAs or InP buffer layer(11) formed on the substrate, an InGaAs channel layer(12) formed on the buffer layer, an InP anti-oxidizing layer(13) formed on the channel layer, and a high concentration N-type InGaAs ohmic/oxide layer(14) formed on the anti-oxidizing layer. At this time, the InGaAs oxide layer is formed by using the following two-step process. The Ga and As of an InGaAs layer are oxidized by using an acidity controlled liquid phase oxidation solution. The In of the InGaAs layer is then oxidized by using an oxygen plasma process.
机译:目的:提供用于基于InP的MOSFET(金属氧化物半导体场效应晶体管)的外延结构和使用该外延结构的MOSFET的制造方法,以能够通过执行液相氧化步骤和氧气来获得稳定且均匀的器件特性等离子处理步骤。组成:外延结构具有半绝缘的InP衬底(10),在衬底上形成的InAlAs或InP缓冲层(11),在缓冲层上形成的InGaAs沟道层(12),InP抗氧化在沟道层上形成层(13),并在抗氧化层上形成高浓度N型InGaAs欧姆/氧化物层(14)。此时,通过使用以下两步工艺来形成InGaAs氧化物层。通过使用酸度控制的液相氧化溶液来氧化InGaAs层的Ga和As。然后,通过使用氧等离子体工艺来氧化InGaAs层的In。

著录项

  • 公开/公告号KR100462395B1

    专利类型

  • 公开/公告日2004-12-17

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20010084249

  • 申请日2001-12-24

  • 分类号H01L29/78;

  • 国家 KR

  • 入库时间 2022-08-21 22:06:14

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