首页> 外国专利> DUAL GATE OXIDE LAYER STRUCTURE FORMED ON AN ENHANCED ACTIVE REGION STRUCTURE WITH HEIGHT LARGER THAN THAT OF ISOLATION REGION IN SEMICONDUCTOR DEVICE AND FORMING METHOD THEREBY

DUAL GATE OXIDE LAYER STRUCTURE FORMED ON AN ENHANCED ACTIVE REGION STRUCTURE WITH HEIGHT LARGER THAN THAT OF ISOLATION REGION IN SEMICONDUCTOR DEVICE AND FORMING METHOD THEREBY

机译:在半导体器件中高度大于隔离区的增强的有源区结构上形成的双栅氧化层结构及其形成方法

摘要

PURPOSE: A dual gate oxide layer structure in a semiconductor device and a forming method thereby are provided to utilize even sidewalls of a trench as an active region, to prevent the stringer due to a stepped portion between an active region and an isolation region, and to restrain a dent from being generated at an interface between the active and isolation regions by lowering an isolation layer under an upper surface of the active region. CONSTITUTION: Trenches(t1,t2) for defining a first active region and a second active region are in a semiconductor substrate(200). Each trench is filled with an isolation layer(208). An upper most portion of each isolation layer becomes lower than upper surfaces of the first and second active regions by etching the isolation layer as much as predetermined thickness. A first gate oxide layer(214) made of a first thermal oxidation layer is formed on the second active region and at first sidewalls(215) of the unfilled trenches. A second gate oxide layer(216) made of a second thermal oxidation layer is formed on the first active region and at second sidewalls(217) of the unfilled trenches. The first gate oxide layer is thicker than the second gate oxide layer.
机译:用途:提供一种半导体器件中的双栅氧化层结构及其形成方法,以利用沟槽的平坦侧壁作为有源区,以防止由于有源区和隔离区之间的台阶部分而引起的纵梁;以及通过降低有源区的上表面下方的隔离层来抑制在有源区与隔离区之间的界面处产生凹痕。构成:用于限定第一有源区和第二有源区的沟槽(t1,t2)在半导体衬底(200)中。每个沟槽填充有隔离层(208)。通过将隔离层蚀刻至预定厚度,每个隔离层的最上部分变得低于第一有源区域和第二有源区域的上表面。由第一热氧化层制成的第一栅氧化层(214)形成在第二有源区上和未填充沟槽的第一侧壁(215)上。在第一有源区上和未填充沟槽的第二侧壁(217)上形成由第二热氧化层制成的第二栅氧化层(216)。第一栅极氧化物层比第二栅极氧化物层厚。

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