SEMICONDUCTOR DEVICE AND HYBRID INTEGRATED CIRCUIT DEVICE FOR PREVENTING BREAKDOWN OF INTEGRATED CIRCUIT CHIP BY RADIATING HEAT FROM INTEGRATED CIRCUIT CHIP TO OUTSIDE OF RESIN SEALING PART

摘要

PURPOSE: A semiconductor device and a hybrid integrated circuit device are provided to prevent a breakdown of an integrated circuit chip by radiating the heat from the integrated circuit chip to an outside of a resin sealing part. CONSTITUTION: A semiconductor device is fixed to an island. Each front end of plural individual leads(24A,24B) extends nearly to the island. A plurality of common leads(24M-24Q) are connected to the island. A resin sealing part(31) is used for sealing the semiconductor device, the island, the individual leads, and the common leads by using resin. A connector(30) is installed at the common lead, which is exposed from the resin sealing part.