首页> 外国专利> ETCHING METHOD INCLUDING PLASMA PRE-TREATMENT FOR GENERATING CARBON CONTAINED FLUORINE-FREE-POLYMER ON PHOTORESIST PATTERN FOR IMPROVING ENDURANCE OF PHOTORESIST PATTERN BY PERFORMING PRE-TREATMENT USING CARBON MONOXIDE PLASMA

ETCHING METHOD INCLUDING PLASMA PRE-TREATMENT FOR GENERATING CARBON CONTAINED FLUORINE-FREE-POLYMER ON PHOTORESIST PATTERN FOR IMPROVING ENDURANCE OF PHOTORESIST PATTERN BY PERFORMING PRE-TREATMENT USING CARBON MONOXIDE PLASMA

机译:包括等离子体预处理的方法,在光致抗蚀剂图案上生成含碳的氟-无氟聚合物,以通过使用一氧化碳等离子体进行预处理来提高光致抗蚀剂图案的耐力

摘要

PURPOSE: An etching method including a plasma pre-treatment for generating a carbon contained fluorine-free-polymer on a photoresist pattern is provided to improve the endurance of the photoresist pattern by performing the pre-treatment using carbon monoxide plasma. CONSTITUTION: A photoresist pattern induction process is performed to provide a photoresist pattern(110). A plasma process for the photoresist pattern is performed by using plasma providing a carbon radical(120). An etching target layer is selectively etched by using the photoresist pattern as an etch mask(130). In the plasma process, the plasma is excited from carbon monoxide. In addition, the plasma is excited from carbon dioxide.
机译:目的:提供一种蚀刻方法,其包括用于在光致抗蚀剂图案上产生含碳的无氟聚合物的等离子体预处理,以通过使用一氧化碳等离子体进行预处理来提高光致抗蚀剂图案的耐久性。组成:进行光致抗蚀剂图案诱导工艺以提供光致抗蚀剂图案(110)。通过使用提供碳自由基的等离子体来执行用于光致抗蚀剂图案的等离子体工艺(120)。通过使用光致抗蚀剂图案作为蚀刻掩模来选择性地蚀刻蚀刻目标层(130)。在等离子体工艺中,等离子体由一氧化碳激发。另外,等离子体由二氧化碳激发。

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