首页> 外国专利> SEMICONDUCTOR DEVICE HAVING ELEVATED SOURCE/DRAIN REGIONS AND METHOD OF FABRICATING THE SAME FOR PREVENTING ABNORMAL EPITAXIAL GROWTH BY REMOVING DEFECTIVE PARTS AFTER IMPLANTING IONS

SEMICONDUCTOR DEVICE HAVING ELEVATED SOURCE/DRAIN REGIONS AND METHOD OF FABRICATING THE SAME FOR PREVENTING ABNORMAL EPITAXIAL GROWTH BY REMOVING DEFECTIVE PARTS AFTER IMPLANTING IONS

机译:具有升高的源/漏区的半导体器件及其制造方法,通过在注入离子后去除缺陷部位来防止异常的表皮生长

摘要

PURPOSE: A semiconductor device having elevated source/drain regions and a method of fabricating the same are provided to prevent abnormal epitaxial growth by removing defective parts after implanting ions. CONSTITUTION: A gate pattern(18) is formed on a substrate(10). A sidewall spacer(22) is formed on a sidewall of the gate pattern. A recess region(24) is arranged in an outer wall of the sidewall spacer. An epitaxial layer(26) is formed on the recess region. An extension impurity region(20) is formed within the substrate under the sidewall spacer. A highly doped impurity region(30) having a junction depth deeper than the extension impurity region is formed on the epitaxial layer and the substrate under the epitaxial layer. The density of the highly doped impurity region is increased gradually from a bottom part to a top part of the epitaxial layer.
机译:目的:提供一种具有升高的源/漏区的半导体器件及其制造方法,以通过在注入离子之后去除缺陷部分来防止异常的外延生长。构成:在基板(10)上形成栅极图案(18)。在栅极图案的侧壁上形成侧壁隔离物(22)。在侧壁间隔物的外壁中布置有凹入区域(24)。在凹陷区域上形成外延层(26)。在侧壁间隔物下方的衬底内形成延伸杂质区(20)。在外延层和在外延层下面的衬底上形成结深度比延伸杂质区深的高掺杂杂质区(30)。高掺杂杂质区域的密度从外延层的底部到顶部逐渐增加。

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