首页> 外国专利> LASER DIODE HAVING VERTICAL ELECTRODE STRUCTURE USING SAPPHIRE ETCHING METHOD AND FABRICATING METHOD THEREOF FOR REDUCING AREA OF CHIP BY FORMING TWO ELECTRODES ON TOP SIDE AND BOTTOM SIDE OF CHIP

LASER DIODE HAVING VERTICAL ELECTRODE STRUCTURE USING SAPPHIRE ETCHING METHOD AND FABRICATING METHOD THEREOF FOR REDUCING AREA OF CHIP BY FORMING TWO ELECTRODES ON TOP SIDE AND BOTTOM SIDE OF CHIP

机译:利用蓝宝石刻蚀法和具有其制造方法的具有垂直电极结构的激光二极管,通过在芯片的顶部和底部形成两个电极来减小芯片的面积

摘要

PURPOSE: A laser diode having a vertical electrode structure using a sapphire etching method and a fabricating method thereof are provided to improve chip production per a wafer by reducing an area of a chip based on two electrodes formed in both sides of the chip. CONSTITUTION: A base substrate(17) includes a stripe via hole. A first conductive type contact layer(15) is formed on the base substrate. A first conductive type clad layer(14) is formed on the first conductive type contact layer. A light emitting layer(13) is formed on the first conductive type clad layer. A second conductive type clad layer(12) is formed on the light emitting layer. A second conductive type contact layer(11) is formed on the second conductive type clad layer. A first electrode(21) is formed on the second conductive type contact layer. A second electrode(19) is connected to the first conductive type contact layer through the stripe via hole.
机译:目的:提供一种具有使用蓝宝石蚀刻方法的垂直电极结构的激光二极管及其制造方法,以通过基于在芯片的两侧形成的两个电极减小芯片的面积来提高每个晶片的芯片产量。组成:基础基板(17)上有一个带状通孔。在基底基板上形成第一导电型接触层(15)。在第一导电类型接触层上形成第一导电类型覆盖层(14)。在第一导电类型覆盖层上形成发光层(13)。在发光层上形成第二导电类型覆盖层(12)。在第二导电类型覆盖层上形成第二导电类型接触层(11)。在第二导电型接触层上形成第一电极(21)。第二电极(19)通过条纹通孔连接到第一导电类型接触层。

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