METHOD OF ATTACHING SOLDER BALL TO SEMICONDUCTOR PACKAGE WITHOUT DETACHMENT USING BALL BUMP OR WIRE LOOP AND SEMICONDUCTOR PACKAGE MANUFACTURED THEREBY

摘要

PURPOSE: A method of attaching a solder ball to a semiconductor package and the semiconductor package manufactured thereby are provided to improve the intensity of attachment of a solder ball by embedding a ball bump or a wire loop connected with a solder ball land into the solder ball. CONSTITUTION: Solder ball lands(12) of a substrate(11) are exposed to the outside by using a solder mask(13) with a predetermined pattern. A gold ball(22a) is attached on each solder ball land by using wire-bonding. By cutting a gold wire(21a) connected with the gold ball, a plurality of ball bumps are formed on the solder ball land. A flux is coated on the solder ball land. A ball bump embedded in solder ball(15) is formed on the solder ball land by using a re-flow manner.