Packaging Density Study: Analysis and Methods for 'Ball Park' Estimates of Packaging Efficiency

摘要

The memorandum presents data pertinent to packaging efficiency and density, represented by three missile electronic packaging techniques. A transistorized receiver, consisting of an average population of conventional components from one type of missile, is compared to a vacuum tube system also consisting of generally conventional hardware from another missile. Both are compared to a third missile design involving packaging where water cooling is required. The subassemblies are examined and compared on the following points. (1) Number and types of components, (2) Volume of unit, and (3) Surface area density (Population). The components of each subassembly are itemized for comparison and are converted into a standard evaluation unit which allows population density comparisons to be made. By applying a similar technique to any 'average' schematic, a comparison of data will predict the minimum size, volume and density that can be constructed. The packages are compared on the basis of tube density, weight density and heat concentration. (Author)