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METHOD OF MANUFACTURING FIELD EFFECT TRANSISTOR OF SEMICONDUCTOR DEVICE FOR FORMING GATE INSULATING LAYER HAVING BOTTOM FACE WIDER THAN TOP FACE
METHOD OF MANUFACTURING FIELD EFFECT TRANSISTOR OF SEMICONDUCTOR DEVICE FOR FORMING GATE INSULATING LAYER HAVING BOTTOM FACE WIDER THAN TOP FACE
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机译:制造半导体器件的场效应晶体管的方法,该器件用于形成绝缘层,该绝缘层具有比顶部表面更底部的表面
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摘要
PURPOSE: A method of manufacturing a field-effect-transistor of a semiconductor device is provided to improve the yield and the current performance by preventing a GOI(Gate On insulator) fail and increasing a width of a transistor. CONSTITUTION: A first insulating layer is formed on a semiconductor substrate. A first conductor is formed thereon to form a pin. A voltage control region is formed by an ion implantation process. A gate insulating layer is formed by performing a thermal process. A second conductor is formed by depositing a conductor thereon and patterning the conductor. An LDD(Lightly doped drain) region is formed by an ion implantation process. A spacer(8) is formed by depositing and etching an insulating layer. A source/drain is formed by implanting ions(9).
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