ADHESIVE FILM FOR SEMICONDUCTOR, METAL SHEET WITH SUCH ADHESIVE FILM, WIRING SUBSTRATE WITH ADHESIVE FILM, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

The semiconductor adhesive film of this invention is an adhesive film for semiconductors used for the method of sticking a semiconductor adhesive film to one surface of a metal plate, processing a metal plate to make a wiring circuit, mounting, sealing, and peeling a semiconductor element, Resin layer A is formed on one side or both sides of a support film, and the 90 degree peeling strength in 25 degreeC of resin layer A and a metal plate before processing the metal plate bonded to the adhesive film for semiconductors to make a wiring circuit is 20 N / m or more, and the 90 degree peeling strength in at least one point of the 0-250 degreeC temperature range of the resin layer A, wiring circuit, and sealing material after sealing the wiring circuit bonded to the adhesive film for semiconductors with a sealing material is However, it is 1000 N / m or less.