DOUBLE STACKED BGA PACKAGE AND MULTI-STACKED BGA PACKAGE

摘要

Provided are double stacked and multiple stacked BGA packages in which two or more BGA packages are stacked to increase the packaging density. Each of the individual BGA packages included in the stacked BGA packages includes at least one semiconductor chip and a substrate on which the chip is mounted with the substrate(s) being sized to be approximately the same size or, in some instances, slightly larger than the semiconductor chip(s) mounted thereon. A plurality of external contact terminals are provided on each of the substrates, with the corresponding external contact terminals of the multiple BGA packages being electrically connected using a flexible substrate.