Double stacked BGA package and multi-stacked BGA package

摘要

The double- stacked BGA packages and multi- stacked BGA package is disclosed. Dual stack BGA package of the present invention includes a lower BGA package having a first external connecting terminal on the substrate , adhesion between the back and bottom of the BGA package and the BGA package and the top having a second external connecting terminal on the substrate , and the first comprises a flexible circuit board for connecting the external connection terminals and the second external connection terminal . According to the present invention , a dual stack BGA package of the present invention , because a BGA package stack and substantially similar to the size of the overall package size of the built-in chip , the higher the mounting efficiency per unit area . ; BGA package . Mount efficiency , package size , double- stacked BGA package , multi- stacked BGA package