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FLIP CHIP BONDIG METHOD FOR ENHANCING THE PERFORMANCE OF CONNECTION IN FLIP CHIP PACKAGING PROCESS AND LAYERED METAL ARCHITECTURE OF SUBSTRATE FOR STUD BUMP
FLIP CHIP BONDIG METHOD FOR ENHANCING THE PERFORMANCE OF CONNECTION IN FLIP CHIP PACKAGING PROCESS AND LAYERED METAL ARCHITECTURE OF SUBSTRATE FOR STUD BUMP
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机译:倒装芯片邦定方法,用于增强倒装芯片包装过程中桩连接的性能和层状金属结构的连接性能
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摘要
A flip chip bonding method and substrate architecture are disclosed for enhancing bonding performance between a chip and a substrate by forming a bump on the chip or the substrate. The flip chip bonding method includes performing pretreatment of a wafer having chips, dicing, and obtaining the pretreated individual chip; performing pretreatment of a substrate; aligning the pads of the pretreated chip with the pads of the pretreated substrate, and bonding the chip and the substrate together by applying an ultrasonic wave and heat using a collet and simultaneously applying pressure. Post treatment is performed by filling or molding resin after bonding. The chip or the substrate is formed with a plated bump, a stud bump or a wedge bump. The stud bump or the wedge bump can be additionally formed on the plated bump.
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