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METHOD AND STRUCTURE TO REDUCE RISK OF GOLD EMBRITTLEMENT IN SOLDER JOINTS
METHOD AND STRUCTURE TO REDUCE RISK OF GOLD EMBRITTLEMENT IN SOLDER JOINTS
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机译:减少焊点金沉着风险的方法和结构
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摘要
A method for reducing gold embrittlement in solder joints, and a copper-bearing solder according to the method, are disclosed. Embodiments of the invention comprise adding copper to non-copper based solder, such as tin-lead solder. The embodiments may further comprise using the copper-bearing solder as a solder interconnect on a gold-nickel pad.
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