首页> 外国专利> How to attach lead parts and shield case to printed board and how to attach chip parts, lead part and shield case to printed board

How to attach lead parts and shield case to printed board and how to attach chip parts, lead part and shield case to printed board

机译:如何将引线零件和屏蔽盒连接到印刷电路板上以及如何将芯片零件,引线零件和屏蔽盒连接到印刷电路板

摘要

Compared to the conventional method, the method of attaching the lead parts and the shield case to the printed circuit board and the chip parts can reduce the process and the labor, and improve the solder coating accuracy for soldering the printed circuit board and the shield case. , A method for attaching lead parts and shield cases to printed circuit boards is proposed.;The plurality of leads 4L of the printed circuit board 1 and the plurality of leads 4L and the parts 4 of a part of the wiring pattern in the vicinity of each hole into which the leads 4L of the parts 4 should be inserted. Solders 3 and 6, respectively, on the land L formed of a conductive layer in the vicinity of the slit into which each part having the fragments 5N of the plurality of shield cases 5 respectively corresponding thereto is inserted. And a plurality of leads 4L and the respective leads 4L of the parts 4 through the holes of the printed board 1, and surrounds the leads 4L and the parts 4, respectively. As shown in the figure, each part of each of the plurality of shield cases 5 having sections 5N is penetrated through the slit of the printed circuit board 1, and each section 5N is bent to the land side to lead 4L and parts. (4) and the process of loading the shield case 5 to the printed circuit board 1, and the printed circuit board 1 on which the plurality of leads 4L, parts 4, and the plurality of shield cases 5 are loaded. Frolow And then dissolving the solder, and cooling to cool the plurality of leads 4L, each lead 4L of the component 4 and each piece 5N of the plurality of shield cases 5 to the predetermined wiring of the printed circuit board 1. And a step of soldering the pattern to the printed circuit board 1 and cutting the printed board 1 into groups of the leads 4L, the parts 4, and the shield cases 5, and obtaining a plurality of individual circuit blocks. .
机译:与常规方法相比,将引线部分和屏蔽盒附接到印刷电路板和芯片部件的方法可以减少工艺和劳动,并提高用于焊接印刷电路板和屏蔽盒的焊料涂覆精度。 ,提出了一种用于将引线部件和屏蔽壳附接到印刷电路板上的方法。印刷电路板1的多个引线4L以及多个引线4L和布线图案的一部分的在附近的部分4零件4的引线4L应插入的每个孔。在狭缝附近的由导电层形成的焊盘L上分别插入焊料3和6,在该狭缝L中插入具有分别与之相对应的多个屏蔽壳5的碎片5N的每个部分。并且多个引线4L和部分4的各个引线4L穿过印刷板1的孔,并分别围绕引线4L和部分4。如图所示,具有部分5N的多个屏蔽壳5中的每一个的每个部分都穿过印刷电路板1的狭缝,并且每个部分5N弯曲到焊盘侧以引出引线4L和各部分。 (4)以及将屏蔽壳5装载到印刷电路板1上的过程,以及在其上装载有多个引线4L,部件4和多个屏蔽壳5的印刷电路板1上。使焊料溶解,然后冷却以冷却多根引线4L,部件4的每根引线4L和多个屏蔽盒5的每片5N到印刷电路板1的预定布线。将图案焊接到印刷电路板1上并将印刷电路板1切割成引线4L,部件4和屏蔽壳5的组,并获得多个单独的电路块。 。

著录项

  • 公开/公告号KR100491502B1

    专利类型

  • 公开/公告日2005-09-26

    原文格式PDF

  • 申请/专利权人 소니 가부시끼 가이샤;

    申请/专利号KR19970039220

  • 发明设计人 쓰루사끼 아라따;

    申请日1997-08-18

  • 分类号H05K3/12;

  • 国家 KR

  • 入库时间 2022-08-21 22:03:50

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