A vacuum packaged microgyroscope and a fabricating method thereof

摘要

PURPOSE: A micro-gyroscope of high vacuum package and a producing method thereof are provided to improve vacuum rate by minimizing the area of a device while reducing a wire between circuits and by sealing at a low temperature using the eutectic reaction of metal and Si. CONSTITUTION: A space for forming the suspension structure of a micro-gyroscope is secured by etching a first substrate(11). And a polysilicon layer(14) and a sacrifice layer(15) are deposited on the etched surface of the first substrate, and the suspension structure is completed by etching the polysilicon layer. And a circuit for treating a signal is formed on a second substrate(12) for detecting the moving state of the suspension structure. Also, an anisotropic etching or metal/Si multilayer(17) is formed on the second substrate for wiring and vacuum packaging. And a first and a second substrates are sealed by using the eutectic bonding method of the metal/Si multilayer. An insulated film and metal film pattern layer is formed on the upper surface of the second substrate for forming an external wiring pole(20) by etching the edges of the second substrate. Therefore, the micro-gyroscope of high vacuum package is obtained.