首页> 外国专利> Method of forming indium tin oxide thin film including a seed layer and a bulk layer utilizing an optimized sequential sputter deposition

Method of forming indium tin oxide thin film including a seed layer and a bulk layer utilizing an optimized sequential sputter deposition

机译:利用优化的顺序溅射沉积形成包括种子层和体层的铟锡氧化物薄膜的方法

摘要

The present invention relates to an indium tin oxide thin film formation method having a second planarized surface characteristics at the ITO electrode constituting a display such as LCD, OLED.; The present invention on the substrate in the sputtering gas supplied to the ion source under the display device a transparent conductive electrode of a transparent when forming the indium tin oxide thin film separated by a seed layer and a bulk layer on a substrate, giving an oxygen atmosphere flowing in the vicinity of the substrate in the first sputter deposition process for forming the indium tin oxide thin film and the second sputter deposition process for forming the indium tin oxide thin film on the substrate with only the sputtering gas was supplied to the ion source and, and the seed layer and deposition of the bulk layer provides a first sputter deposition process or the second sputtering indium tin oxide thin film forming method characterized in that it has a different process conditions in the deposition process.
机译:本发明涉及一种铟锡氧化物薄膜的形成方法,该方法在构成诸如LCD,OLED的显示器的ITO电极上具有第二平坦化的表面特性。本发明在向显示装置下方的离子源供给溅射气体的基板上,在基板上形成由籽晶层和主体层隔开的铟锡氧化物薄膜时,形成透明的透明导电电极,从而产生氧在仅溅射气体的情况下,在用于形成铟锡氧化物薄膜的第一溅射沉积工艺和用于在衬底上形成铟锡氧化物薄膜的第二溅射沉积工艺中在衬底附近流动的气氛被提供给离子源。并且,种子层和本体层的沉积提供了第一溅射沉积工艺或第二溅射铟锡氧化物薄膜形成方法,其特征在于,其在沉积工艺中具有不同的工艺条件。

著录项

  • 公开/公告号KR100514952B1

    专利类型

  • 公开/公告日2005-09-14

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20030002838

  • 发明设计人 백영환;조준식;한영건;고석근;

    申请日2003-01-15

  • 分类号H05B33/10;

  • 国家 KR

  • 入库时间 2022-08-21 22:03:27

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